(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Product Description
The Rogers RO3203 High Frequency PCB is a custom-made 2-layer circuit board featuring Rogers 3203 material with a thickness of 10 mils. This high-performance PCB is designed for applications requiring exceptional electrical performance and mechanical stability, particularly in microwave frequency ranges.
Material Properties
Rogers RO3203 is a ceramic-filled laminate reinforced with woven fiberglass. It boasts the following key properties:
Dielectric Constant (DK): 3.02
Dissipation Factor (DF): 0.0016
Frequency Range: Extends beyond 40 GHz
RO3203 combines the surface smoothness of non-woven PTFE laminates for fine line etching tolerances with the rigidity of woven-glass PTFE laminates. These materials can be processed using standard PTFE circuit board manufacturing techniques. Available copper cladding options include 0.5, 1, or 2 oz./ft² (17, 35, 70 microns thick) of electrodeposited copper foil. The manufacturing process is compliant with ISO 9002 quality standards.
Features
1.Woven Glass Reinforcement: Enhances rigidity for easier handling.
2.Uniform Performance: Ideal for complex multilayer high-frequency structures.
3.Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
4.Excellent Mechanical Properties: Supports multilayer board designs.
5.Low In-Plane Expansion Coefficient: Matches copper for reliable hybrid designs.
6.Dimensional Stability: Ensures high production yields.
7.Cost-Effective: Economically priced for volume manufacturing.
8.Smooth Surface: Allows for finer line etching tolerances.
Typical Applications
1.Automotive Collision Avoidance Systems
2.Automotive Global Positioning Satellite Antennas
3.Base Station Infrastructure
4.Datalink on Cable Systems
5.Direct Broadcast Satellites
6.LMDS and Wireless Broadband
7.Microstrip Patch Antennas
8.Power Backplanes
9.Remote Meter Readers
10.Wireless Telecommunications Systems
PCB Capability (RO3203)
PCB Capability (RO3203) |
|
PCB Material: |
Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: |
RO3203 |
Dielectric constant: |
3.02±0.04 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin and OSP etc.. |
Data Sheet of RO3203
RO3203 Typical Value |
|||||
Property |
RO3203 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.02±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Dissipation Factor,tanδ |
0.0016 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Conductivity |
0.47 (3.2) |
|
W/mK |
Float 100℃ |
ASTM C518 |
Volume Resistivity |
107 |
|
MΩ.cm |
A |
ASTM D257 |
Surface Resistivity |
107 |
|
MΩ |
A |
ASTM D257 |
Dimensional Stability |
0.08 |
X, Y |
mm/m +E2/150 |
after etch |
IPC-TM-650 2.4.3.9 |
Tensile Modulus |
|
X Y |
kpsi |
RT |
ASTM D638 |
Flexural Modulus |
400 300 |
X Y |
kpsi |
A |
ASTM D790 |
Tensile Strength |
12.5 13 |
X Y |
kpsi |
RT |
ASTM D638 |
Flexural Strength |
9 8 |
X Y |
kpsi |
A |
ASTM D790 |
Moisure Absorption |
<0.1 |
|
% |
D24/23 |
IPC-TM-650 2.6.2.1 |
Coefficient of Thermal Expansion |
58 13 |
Z X,Y |
ppm/℃ |
-50 ℃to 288℃ |
ASTM D3386 |
Td |
500 |
|
℃ |
TGA |
ASTM D3850 |
Density |
2.1 |
|
gm/cm3 |
23℃ |
ASTM D792 |
Copper Peel Stength |
10 (1.74) |
|
lbs/in (N/mm) |
After solder |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-Free Process Compatible |
Yes |
|
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